SUMMARY
Today’s PCB designers and engineers must contend with increasing data rates and decreasing timing budgets. At higher frequencies, cutting corners can mean costly respins and missed delivery dates.
In the High-Speed Design for Signal Integrity workshop, instructor Dr. Eric Bogatin explains the principles of high-speed PCB design and signal integrity. Attendees will learn – through real-world examples – how PCB design techniques can affect signal integrity, as well as what you need to know about characteristic impedance, differential impedance, crosstalk and high-speed serial links.
Attendees will gain in-depth knowledge about:
•Ground Bounce
•Reflections
•Bandwidth
•Differential Pairs
•Decoupling Capacitors
•Rules of Thumb – Which Ones Are Vital?
High-Speed Design for Signal Integrity will provide you the up-to-date information you need for designing the high-speed PCBs of today.
WHO SHOULD ATTEND
PCB designers and engineers seeking a greater understanding of high-speed design techniques and signal integrity issues.
 ABOUT THE INSTRUCTOR
Dr. Eric Bogatin, the “Signal Integrity Evangelist,” is a renowned signal integrity expert and veteran instructor. He received his B.S. in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Dr. Bogatin worked with a number of microelectronics companies, including AT&T Bell Labs, Raychem Corp. and Sun Microsystems, before serving as CTO of Interconnect Devices, Inc.. He has taught signal integrity classes at conferences and workshops around the world. He is the author of Signal Integrity: Simplified, as well as hundreds of technical articles on signal integrity and interconnect design. Dr. Bogatin is a columnist and editor with PCBDesign007 and PCB007DesignChina. Eric is currently President of Bogatin Enterprises, the world leader in signal integrity training. Many of his papers can be found at www.beTheSignal.com
Read Eric's blog: "What I Learned This Month" |
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截止日期2010年3月17日
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